FN2137 Rev 2.00

Page 8 of 8

August 1995

HCTS02MS

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Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 x 4 mils

Metallization Mask Layout

HCTS02MS

Y1

VCC

Y4

A1 (2)

B1 (3)

Y2 (4)

A2 (5)

(12) B4

(11) A4

(10) Y3

(9) B3

(6)

(7)

(8)

(1)

(14)

(13)

B2

GND

A3