DA7282-00FVC datasheet(14/88 Pages) RENESAS

14 / 88 page

DA7282

LRA/ERM Ultra-Low Power Haptic Driver with

Multiple Input Triggers and Integrated

Waveform Memory

Datasheet

Revision 3.1

10-Feb-2022

CFR0011-120-00

14 of 87

Table 9: I2C Interface Timing Requirements

Parameter

Description

Conditions

Min

Max

Unit

tBUF

Bus free time from STOP to START

condition

0.5

µs

Standard, Fast, and Fast-Plus Modes

CBUS

Bus line capacitive load

520

fSCL

SCL clock frequency

1000

(Note 1)

kHz

tSETUP_START

Start condition setup time

0.26

µs

tHOLD_START

Start condition hold time

0.26

µs

tLO_SCL

SCL low time

0.5

µs

tHI_SCL

SCL high time

0.26

µs

tRISE

SCL and SDA rise time

120

tFALL

SCL and SDA fall time

120

tSETUP_DATA

Data setup time

tHOLD_DATA

Data hold-time

tSETUP_STOP

Stop condition setup time

0.26

µs

tDATA

Data valid time

0.45

µs

tDATA_ACK

Data valid acknowledge time

0.45

µs

tSPIKE

Spike suppression (SCL, SDA)

Fast/Fast+ mode

Note 1

fSCL maximum is 400 kHz at VDDIO_EN

≤ 1.65 V and 1000 kHz at VDDIO_EN > 1.65 V.

4.5

Thermal Characteristics

Table 10: WLCSP Thermal Ratings

Parameter

Description (Note 1)

Min

Typ

Max

Unit

RƟJA

Junction-to-ambient thermal resistance

90.3

°C/W

RƟJC_TOP

Junction-to-case (top) thermal resistance

43.6

°C/W

RƟJB

Junction-to-board thermal resistance

49.0

°C/W

JT

Junction-to-top characterization parameter

6.4

°C/W

JB

Junction-to-board characterization parameter

45.8

°C/W

Note 1

Multilayer JEDEC standard, still air, ambient temperature 25

°C, simulated value.

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