Page 2 of 3

R19DS0059EJ0330 Rev.3.30

May 10, 2012

R2A30406SP

Absolute Maximum Ratings (Unless otherwise specified, the ambient temperature is 25

C)

Notes: 1. As a rule, do not apply reverse power-supply voltages.

2. Glass epoxy board: 95 mm x 60 mm x 0.7 mm, copper-occupancy ratio in a 4-layer board: 15% in layers 1

and 4, 20% in layers 2 and 3.

3. As a rule, do not apply voltages above the power-supply voltage or below the GND voltage.

4. The total output current does not exceed the rated value in usage with multiple channels simultaneously

turned on.

6.5

6.5

Item

Symbol

VCC

Pd

Tstg

Rated Value

Unit

V

500

Remarks

VM

Allowable power consumption

Power-supply voltage 1

Thermal derating ratio

K



-4.0

mW

mW/

Topr

Ambient operating temperature

Storage temperature

-25~85

-40~150

-0.5~VCC+0.5

Applied input voltages

Vin

V

V

See note 1 below.

See note 1 below.

See note 3 below.

See note 2 below. Ta = 25

C

See note 2 below. Ta

 25C

Tj

Max. junction temperature

150

Iod

Direct current (1ch~4ch)

See note 4 below. DC

Iop

Instantaneous output current

(1ch~4ch)

See note 4 below. Pulse width

< 10 ms, duty cycle

 20%

mA/ch

mA/ch

Thermal Derating Curve

Ambient operating temperature Ta (

C)

Remark: The main component of power consumption by this IC is the power consumed by the output

transistors on channels 1 to 4.

Expression for calculating power consumption by the output transistors

Pd

(F/S) = (output current)² x ON resistance

E.g. Pd

(FS) = (300mA) ² x 1.5ohm=135mW

When the ambient temperature is 25

C or more, refer to the above figure in selecting the required heat sink.

0

20

40

60

80

140

800

400

200

600

100

120

160

-4.0 mW/

500

260

180

Power-supply voltage 2

C

C

C

C

C

400

600