P9028AC

Product Datasheet

Revision 1.0.3

3

©2015IntegratedDeviceTechnology,Inc.

ABSOLUTE MAXIMUM RATINGS

These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may cause permanent damage

to the device. Functional operation of the P9028AC at absolute maximum ratings is not implied. Application of the absolute maximum rating conditions

affects device reliability.

Table 1. Absolute Maximum Ratings Summary.

Description

Value

Units

AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2

-0.3 to 20

V

BST1, BST2

-0.3 to (AC1, AC2 + 6)

V

EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CS100, FOD1, FOD2, VDD

-0.3 to 6

V

PGND, PGND1, PGND2, AGND

-0.3 to 0.3

V

Output Current OUT

1.5

A

Input Current AC1, AC2

2

ARMS

Table 2. Package Thermal Information.1,2,3,4

Symbol

Description

TQFN Rating

WLCSP Rating

(7 thermal vias)

Units

JA

Thermal Resistance Junction to Ambient

35

70

C/W

JC

Thermal Resistance Junction to Case

29.6

0.9

C/W

JB

Thermal Resistance Junction to Board

2.4

47.3

C/W

TJ

Operating Junction Temperature

0 to +125

0 to +125

C

TA

Operating Ambient Temperature

0 to +85

0 to +85

C

TSTG

Storage Temperature

-55 to +150

-55 to +150

C

TLEAD

Maximum Soldering Temperature (at Leads, 10s)

300

300

C

Note 1:

The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will

result in excessive die temperature, and the device will enter thermal shutdown.

Note 2:

This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions.

Note 3:

Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.

Note 4:

For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH)

vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. For the WLCSP (AWG36) package, connecting

the 7 thermal balls to internal/external ground planes from top to bottom sides of the PCB, is recommended for improving the overall thermal performance.

Table 3. ESD Information.

Test

Model

Pins

Rating

Units

HBM

All

±1500

V

CDM

All

±500

V