965

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CD4063BMS

Chip Dimensions and Pad Layout

Dimensions in parenthesis are in millimeters and are

derived from the basic inch dimensions as indicated.

Grid graduations are in mils (10-3 inch).

METALLIZATION:

Thickness: 11k

Å

− 14kÅ, AL.

PASSIVATION:

10.4kÅ - 15.6k

Å, Silane

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches

FIGURE 9. TYPICAL TRANSITION TIME vs LOAD CAPACITANCE

FIGURE 10. TYPICAL POWER DISSIPATION vs FREQUENCY

Typical Performance Characteristics (Continued)

AMBIENT TEMPERATURE (TA) = +25

oC

LOAD CAPACITANCE (CL) (pF)

0

40

60

80

100

20

0

50

100

150

200

SUPPLY VOLTAGE (VDD) = 5V

10V

15V

8

6

4

28

6

4

22

INPUT FREQUENCY (f) (kHz)

0.1

1

10

102

103

8

6

4

28

6

4

6

4

2

6

4

2

6

4

2

6

4

2

103

102

10

1

104

AMBIENT TEMPERATURE (TA) = +25

oC

SUPPLY VOLTAGE (VDD) = 15V

LOAD CAPACITANCE (CL) = 50pF

5V, 50pF

10V, 50pF

10V, 15pF

28

6

4