FN3305 Rev 0.00

Page 7 of 7

December 1992

CD4030BMS

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such

modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its

subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

For additional products, see www.intersil.com/en/products.html

© Copyright Intersil Americas LLC 1999. All Rights Reserved.

All trademarks and registered trademarks are the property of their respective owners.

Chip Dimensions and Pad Layout

FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNC-

TION OF SUPPLY VOLTAGE

FIGURE 9. TYPICAL DYNAMIC POWER DISSIPATION AS A

FUNCTION OF INPUT FREQUENCY

Typical Performance Characteristics (Continued)

AMBIENT TEMPERATURE (TA) = +25oC

SUPPLY VOLTAGE (VDD) (V)

010

15

20

5

100

200

300

LOAD CAPACITANCE (CL) = 50pF

10V

5V

10V

AMBIENT TEMPERATURE (TA) = +25oC

CL = 15pF

CL = 50pF

SUPPLY VOLTAGE

(VDD) = 15V

8

6

4

28

6

4

22

INPUT FREQUENCY (fI) (kHz)

10-1

110

102

103

8

6

4

28

6

42

8

6

4

104

6

4

2

102

10

1

10-1

6

4

2

6

4

2

103

6

4

2

104

6

4

2

105

6

4

2

LOAD CAPACITANCE

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

as indicated. Grid graduations are in mils (10-3 inch)

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches