PCF21XXC_FAM

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 3 — 6 May 2015

19 of 25

NXP Semiconductors

PCF21xxC family

LCD drivers

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 21.

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

16. References

[1]

AN10365 — Surface mount reflow soldering description

[2]

AN10853 — ESD and EMC sensitivity of IC

[3]

AN11267 — EMC and system level ESD design guidelines for LCD drivers

[4]

IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[5]

IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[6]

IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices

[7]

JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[8]

JESD78 — IC Latch-Up Test

[9]

JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[10] SOT136-1_118 — SO28; Reel dry pack; SMD, 13", packing information

[11] SOT158-1_118 — VSO40; Reel pack; SMD, 13", packing information

[12] UM10204 — I2C-bus specification and user manual

[13] UM10569 — Store and transport requirements

MSL: Moisture Sensitivity Level

Fig 21. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature