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SAM9X60SIP bảng dữ liệu(PDF) 32 Page - Microchip Technology

tên linh kiện SAM9X60SIP
Giải thích chi tiết về linh kiện  SAM9X60 System-In-Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM and up to 64 Mbits SDR-SDRAM
PDF  40 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SAM9X60SIP bảng dữ liệu(HTML) 32 Page - Microchip Technology

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RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Contact Pad Spacing
Contact Pitch
MILLIMETERS
0.65 BSC
MIN
E
MAX
9.75
5
4
.
0
X
)
6
9
1
X
(
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t
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i
W
d
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P
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c
a
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o
C
NOM
C1
5
7
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9
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BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
E
ØX
SILK SCREEN
C2
C1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Microchip Technology Drawing C04-23507 Rev B
196-Lead Thin Fine Pitch Ball Grid Array (4GB) - 11x11x1.2 mm Body [TFBGA]
1234
5
678
9 10 11 12 13 14 15 16
G
Space Between Contact Pads
G
0.20
Table 9-5. 196-Ball TFBGA Package Characteristics
Moisture Sensitivity Level
3
Table 9-6. Device and 196-Ball TFBGA Package Weight
Device
Weight (mg)
SAM9X60D6K
251
SAM9X60 SIP
Mechanical Characteristics
© 2021 Microchip Technology Inc.
and its subsidiaries
Datasheet
DS60001580C-page 32



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