VSC8541-01 datasheet(97/100 Pages) MICROSEMI

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Package Information

VMDS-10496 VSC8541-01 Datasheet Revision 4.2

PCB). For more information about the thermal measurement method used for this device, see the

JESD51-1 standard.

To achieve results similar to the modeled thermal measurements, the guidelines for board design

described in the JESD51 family of publications must be applied. For information about applications using

QFN packages, see the following:

•

JESD51-2A, Integrated Circuits Thermal Test Method Environmental Conditions, Natural Convection

(Still Air)

•

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions, Forced Convection

(Moving Air)

•

JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions, Junction-to-Board

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal

Attachment Mechanisms

7.3

Moisture Sensitivity

This device is rated moisture sensitivity level 3 or better as specified in the joint IPC and JEDEC standard

IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.

Table 118 •

Thermal Resistances

Symbol

°C/W

Parameter

θJCtop

19.3

Die junction to package case top

θJB

6.6

Die junction to printed circuit board

θJA

26.6

Die junction to ambient

θJMA at 1 m/s

20.0

Die junction to moving air measured at an air speed of 1 m/s

θJMA at 2 m/s

19.0

Die junction to moving air measured at an air speed of 2 m/s

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