LMK6C datasheet(32/56 Pages) TI

32 / 56 page

Supply Voltage (V)

1.8

2.1

2.4

2.7

3.3

300

600

900

1200

1500

1800

2100

2400

2700

3000

Temp = 25oC

Frequency = 50 MHz

0 pF

2.2 pF

4.7 pF

10 pF

15 pF

22 pF

Figure 10-6. Rise / Fall time (ps) vs Supply Voltage vs Load Capacitance

10.3 Power Supply Recommendations

For the best electrical performance of the LMK6x, TI recommends use 1 µF capacitor on the device power

supply bypass network. TI also recommends using component side mounting of the power-supply bypass

capacitors, and best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections

between the bypass capacitors and the power supply on the device as short as possible. Ground the other side

of the capacitor using a low impedance connection to the ground plane.

10.4 Layout

10.4.1 Layout Guidelines

The following sections provide recommendations for board layout, solder reflow profile and power-supply

bypassing when using the LMK6x to ensure good thermal and electrical performance and signal integrity of

the entire system.

10.4.1.1 Ensuring Thermal Reliability

The LMK6x is a high-performance device. Therefore, pay careful attention to device configuration and printed

circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground

plane of the PCB through three vias or more to maximize thermal dissipation out of the package.

The equation below describes the relationship between the PCB temperature around the LMK6x and its junction

temperature.

TB = TJ – ΨJB × P

(1)

where

• TB: PCB temperature around the LMK6x

• TJ: Junction temperature of LMK6x

• ΨJB: Junction-to-board thermal resistance parameter of LMK6x (refer to the Thermal Information tables in the

Specifications section for this information)

• P: On-chip power dissipation of LMK6x

LMK6C, LMK6D, LMK6H, LMK6P

SNAS826D – APRIL 2022 – REVISED FEBRUARY 2023

www.ti.com

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