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C5EC3EARCH-RM/D bảng dữ liệu(PDF) 77 Page - NXP Semiconductors

tên linh kiện C5EC3EARCH-RM/D
Giải thích chi tiết về linh kiện  C-3e Network Processor Silicon Revision A1
PDF  114 Pages
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C5EC3EARCH-RM/D bảng dữ liệu(HTML) 77 Page - NXP Semiconductors

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Power and Thermal Characteristics
77
03
Figure 11 Package with Heat Sink Mounted to the Printed Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, then
through the heat sink attach material (or thermal interface material), and finally to the
heat sink where it is removed by convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the
temperature drop in the silicon may be neglected. Thus, the thermal interface material
and the heat sink conduction/convective thermal resistances are the dominant terms.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j = T a + T r + (θjc + θint + θsa ) x P d
where:
T
j is the die-junction temperature
T
a is the inlet cabinet ambient temperature
T
r is the air temperature rise within the computer cabinet
External Resistance
Internal Resistance
External Resistance
Radiation
Heat Sink
Printed Circuit Board (PCB)
Radiation
Convection
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Convection
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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