www.statschippac.com

FEATURES

• Body Sizes: 7 x 7mm to 24 x 24mm

• Package Height: 1.0mm (TQFP-ep) and 1.4mm

(LQFP-ep)

• Lead Counts: 32L to 216L

• Lead Pitch: 0.40mm to 0.80mm

• Wide range of open tool leadframe and die pad

sizes available

• JEDEC standard compliant

• Lead-free and Green material sets available

APPLICATIONS

• ASIC

• DSP

• Gate Array

• Logic, Microprocessors/Controllers

• Multimedia, PC Chipsets, Others

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• 7 x 7mm to 24 x 24mm body sizes

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• 32 to 216 lead count

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• Lead pitch range from 0.80mm

to 0.40mm

DESCRIPTION

STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a

thermally enhanced version of the QFP package. Thermal

enhancement is achieved by means of an exposed die pad,

which can be soldered to a mother PC board for effective

heat removal and grounding. STATS ChipPAC’s QFP-ep family

includes the Exposed Pad-Low Profile QFP (LQFP-ep) and

the Exposed Pad-Thin QFP (TQFP-ep). These enhanced

thermal packages are made possible by deep downset die

pad leadframe design combined with well controlled low

loop wirebonding and package warpage control during the

molding process.

QFP-ep

Exposed Pad Quad Flat Pack