7

Notes about FLAT-16P package

The bottom of package is metallized to allow user to directly solder the voltage regulator to PCB, no heat sink

needed, in order to optimize heat removal performance.

This AlN ceramic package features a low thermal coefficient of expansion (TCE) significantly lower than the TCE

of some PCBs. TCE= 4.7 ppm/K; Thermal conductivity= 150 W/mK.

It is therefore recommended, especially when its bottom metallic dissipation plate is brazed (as opposed to

glued), to carefully design the PCB (material, thickness, layout…) and the mounting process to secure that the

package and the solder joint can sustain the worst case temperature cycling its must be qualified for ( the highest

constraints are at lowest temperature). It is strongly recommended to make sure that the actual mounting is well

covered by the qualified mounting process for each parameters (PCB material, thickness, layout, temperature

profile...).

7.1

Radiation performance

The RHFL4913F has been tested against: 300 krad TID ELDERS in accordance with Mil-1019.6, bipolar section:

post radiation parameters are within datasheet pre-rad limits.

Submitted to 200 MeV Iodine ions of 60.4 MeV/cm2/mg LET up to 1exp(+7) ions / cm2, no SEL event has been

detected.

7.2

Die information

The RHFL4913 fixed is also available in die form. Space dice are electrically tested by STMicroelectronics in such

a way that, when mounted in proper thermal and electrical substrate, they provide full compliance with equivalent

packaged product.

•

Max. die dimensions: 2.794 mm by 3.861 mm or 110 mils by 152 mils

•

Die thickness: 357 μm +/- 50 μm

•

Pad size: 184 μm by 184 μm

•

Metallization: Aluminum 4% silicon alloy

•

Die backside: Bare silicon

•

Die backside potential: Ground

Figure 5. Die size

Note:

Die SENSE pad is active in the RHFL4913 fixed die. It shall not be left unbonded. It should be bonded to VO pin.

Die adjust pad is available in the die layout but is not electrically connected to the IC. It shall be left unconnected

during hybrid bonding.

RHFL4913XX25, RHFL4913XX33, RHFL4913XX50

Notes about FLAT-16P package

DS3260 - Rev 15

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