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TPS548C26 bảng dữ liệu(PDF) 26 Page - Texas Instruments

tên linh kiện TPS548C26
Giải thích chi tiết về linh kiện  TPS548C26 4-V to 16-V Input, 35-A Synchronous Buck Converter with Differential Remote Sense
PDF  39 Pages
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nhà sản xuất  TI [Texas Instruments]
Trang chủ  http://www.ti.com
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TPS548C26 bảng dữ liệu(HTML) 26 Page - Texas Instruments

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Figure 8-14. Output Voltage Ripple, 800 kHz FCCM,
35 A Load, PVIN = 12 V, VOUT = 3.3 V
Figure 8-15. Output Voltage Ripple, 800 kHz FCCM,
No load, PVIN = 12 V, VOUT = 3.3 V
Figure 8-16. Output Voltage Ripple, DCM, No load, PVIN = 12 V, VOUT = 3.3 V
8.3 Power Supply Recommendations
The device is designed to operate from a wide input voltage supply range between 2.7 V and 16 V when the
VDRV pin is powered by an external bias ranging from 4.75 V to 5.3 V. Both input supplies (PVIN and VDRV
bias) must be well regulated. Proper bypassing of input supplies (PVIN and VDRV) is also critical for noise
performance, as are PCB layout and grounding scheme. See the recommendations in Layout Guidelines.
8.4 Layout
8.4.1 Layout Guidelines
Layout is critical for good power supply design. Layout example shows the recommended PCB layout
configuration. A list of PCB layout considerations using the device is listed as follows:
• Place the power components (including input and output capacitors, the inductor, and the IC) on the top side
of the PCB. To shield and isolate the small signal traces from noisy power lines, insert at least one solid
ground inner plane.
• PVIN-to-PGND decoupling capacitors are important for FET robustness. Besides the large volume 0603 or
0805 ceramic capacitors, TI highly recommends a 0.1-µF, 0402 ceramic capacitor with 25-V / X7R rating on
PVIN pin 20 (top layer) to bypass any high frequency current in PVIN to PGND loop. TI recommends the
25-V rating, but can be lowered to 16-V rating for an application with tightly regulated 12-V input bus.
• When one or more PVIN-to-PGND decoupling capacitors are placed on bottom layer, extra impedance is
introduced to bypass IC PVIN node to IC PGND node. Placing at least 3 times PVIN vias on PVIN pad
TPS548C26
SLVSGM2 – MARCH 2023
www.ti.com
26
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Product Folder Links: TPS548C26



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