TSOP996..TR1

www.vishay.com

Vishay Semiconductors

Rev. 1.1, 14-Apr-2021

7

Document Number: 82862

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

R1.5

(1.6)

0.9

1.15

2.6

0.4 ± 0.1

(45°)

Area not plane

6.8

5.9

R1.5

R1.5

Marking area

GND

GND

OUT

V

S

0.6 max.

1.27 nom.

3 x 1.27 = 3.81

1.27 nom.

Technical drawings

according to DIN

specification.

More

sen

sitive

angle

Less

sensitive

angle

(3.05)

0.5

Not indicated tolerances ± 0.2

Drawing-No.: MM-200-220.01-4

Issue 1: 11.04.17

Proposed hole layout

from component side

(for reference only)

(6.1)

(4.9)

(1.27)

(1.27)

(2.54)

(0.7) (4 x)

(7.1)

(0.635)