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74F410 bảng dữ liệu(PDF) 3 Page - NXP Semiconductors

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Giải thích chi tiết về linh kiện  Register stack 16x4 RAM 3-State output register
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74F410 bảng dữ liệu(HTML) 3 Page - NXP Semiconductors

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Philips Semiconductors FAST Products
Product specification
74F410
Register stack – 16
×4 RAM 3-State output register
January 8, 1990
3
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
T
A
=
–
4
0
t
o
+
8
5
°
C
UNIT
MIN
NOM
MAX
VCC
Supply voltage
4.5
5.0
5.5
V
VIH
High–level input voltage
2.0
V
VIL
Low–level input voltage
0.8
V
IIk
Input clamp current
–18
mA
IOH
High–level output current
–3
mA
IOL
Low–level output current
24
mA
Tamb
Operating free air temperature range
0
+70
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS1
LIMITS
UNIT
MIN
TYP2
MAX
VOH
High-level output voltage
VCC = MIN, VIL = MAX
±10%V
CC
2.4
V
VIH = MIN, IOH = MAX
±5%V
CC
2.7
V
VOL
Low-level output voltage
VCC = MIN, VIL = MAX
±10%V
CC
0.35
0.50
V
VIH = MIN, IOL = MAX
±5%V
CC
0.35
0.50
V
VIK
Input clamp voltage
VCC = MIN, II = IIK
-0.73
-1.2
V
II
Input current at maximum input voltage
VCC = MAX, VI = 7.0V
100
µA
IIH
High–level input current
VCC = MAX, VI = 2.7V
20
µA
IIL
Low–level input current
others
VCC = MAX, VI = 0.5V
-0.6
mA
CP, CS
-1.2
mA
IOZH
Offset–output current,
high–level voltage applied
VCC = MAX, VI = 2.7V
50
µA
IOZL
Offset–output current,
low–level voltage applied
VCC = MAX, VI = 0.5V
–50
µA
IOS
Short-circuit output current3
VCC = MAX
-60
-150
mA
ICC
Supply current (total)
VCC = MAX
45
70
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.



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