AP7348

Document number: DS42124 Rev. 3 - 2

3 of 15

www.diodes.com

August 2020

© Diodes Incorporated

AP7348

Functional Block Diagram

OCP

OTP

Vref

OCP

OCP

OTP

Vref

OCP

VDD

VOUT1

VOUT3

VOUT2

VOUT4

GND

GND

GND

EN2

EN1

AP7348 (With Discharge)

Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Ratings

Unit

ESD HBM

Human Body Mode ESD Protection

±2

kV

ESD CDM

Charge Device Model

±500

V

VDD

Input Voltage

6.0

V

VEN

Input Voltage for EN Pins

6.0

V

VOUT

Output Voltage

-0.3 to VDD + 0.3

V

IOUT

Each Channel Output Current

300

mA

PD (Note 5)

Power Dissipation

600

mW

TA

Operating Ambient Temperature

-40 to +85

°C

TSTG

Storage Temperature

-55 to +125

°C

Notes:

4. a). Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only and

functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended period can affect

device reliability.

b). Ratings apply to ambient temperature at +25°C. The JEDEC High-K board design used to derive this data was a 2 inch

 2 inch multilayer board with

1oz. internal power and ground planes and 2oz. copper traces on the top and bottom of the board.

5. Even though AP7348 would provide each channel 300mA, user still need consider power dissipation can

’t over 600mW, or it will enable OTP function

and get abnormal output voltage.

Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Min

Max

Unit

VDD

Input Voltage

1.7

5.25

V

IOUT

Each Channel Output Current

0

300

mA

TA

Operating Ambient Temperature

-40

+85

°C