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S32K311NHT0MPAST bảng dữ liệu(PDF) 3 Page - NXP Semiconductors

tên linh kiện S32K311NHT0MPAST
Giải thích chi tiết về linh kiện  Supports S32K344, S32K324, S32K314, S32K312, S32K341 and S32K342. Data is preliminary for S32K311, S32K310, S32K328, S32K338, S32K348, S32K358 and S32K388
PDF  141 Pages
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nhà sản xuất  NXP [NXP Semiconductors]
Trang chủ  http://www.nxp.com
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S32K311NHT0MPAST bảng dữ liệu(HTML) 3 Page - NXP Semiconductors

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Contents
1
Overview............................................................ 5
2
Block diagram.....................................................5
3
Feature comparison......................................... 12
4
Ordering information.........................................17
4.1
Determining valid orderable parts ................ 17
5
General.............................................................17
5.1
Absolute maximum ratings............................18
5.2
Voltage and current operating requirements.19
5.3
Thermal operating characteristics.................21
5.4
ESD and Latch-up Protection Characteristics
...................................................................... 22
6
Power management......................................... 22
6.1
Power management system - S32K344,
S32K324, S32K341, S32K314, S32K342, and
S32K322....................................................... 23
6.2
Power management system - S32K312,
S32K311, S32K310...................................... 24
6.3
Power management system - S32K358,
S32K348, S32K338, S32K328......................25
6.4
Power management system - S32K388....... 26
6.5
Power mode transition operating behaviors..26
6.5.1
Power mode transition operating behavior... 26
6.5.2
Boot time, HSE firmware not installed.......... 27
6.5.3
Boot time, HSE firmware installed................ 27
6.5.4
HSE firmware memory verification time
examples.......................................................28
6.6
Supply Monitoring......................................... 32
6.7
Recommended Decoupling Capacitors........ 34
6.8
V15 regulator (SMPS option) electrical
specifications................................................ 46
6.9
V15 regulator (BJT option, NPN ballast
transistor control) electrical specifications.... 47
6.10
V11 regulator (NMOS ballast transistor control)
electrical specifications................................. 48
6.11
Supply currents............................................. 49
6.12
Operating mode............................................ 68
6.13
Cyclic wake-up current .................................70
7
I/O parameters................................................. 70
7.1
GPIO DC electrical specifications, 3.3V Range
(2.97V - 3.63V)..............................................70
7.2
GPIO DC electrical specifications, 5.0V (4.5V -
5.5V)............................................................. 74
7.3
5.0V (4.5V - 5.5V) GPIO Output AC
Specification..................................................78
7.4
3.3V (2.97V - 3.63V) GPIO Output AC
Specification..................................................79
8
Glitch Filter....................................................... 80
9
Flash memory specification..............................81
9.1
Flash memory program and erase
specifications................................................ 81
9.2
Flash memory Array Integrity and Margin Read
specifications................................................ 82
9.3
Flash memory module life specifications...... 83
9.3.1
Data retention vs program/erase cycles....... 83
9.4
Flash memory AC timing specifications........ 84
9.5
Flash memory read timing parameters......... 84
10
Analog modules................................................85
10.1
SAR ADC...................................................... 85
10.2
Supply Diagnosis.......................................... 88
10.3
Low Power Comparator (LPCMP)................ 88
10.4
Temperature Sensor..................................... 92
11
Clocking modules............................................. 93
11.1
FIRC..............................................................93
11.2
SIRC............................................................. 93
11.3
PLL................................................................93
11.4
Fast External Oscillator (FXOSC)................. 95
11.5
Slow Crystal Oscillator (SXOSC).................. 97
12
Communication interfaces................................97
12.1
LPSPI............................................................97
12.1.1
LPSPI............................................................97
12.1.2
LPSPI0 20 MHz and 15 MHz Combinations102
12.2
I2C...............................................................102
12.3
FlexCAN characteristics..............................102
12.4
SAI electrical specifications........................ 102
12.4.1
SAI Electrical Characteristics, Slave Mode.102
12.4.2
SAI Electrical Characteristics, Master Mode104
12.5
Ethernet characteristics.............................. 105
12.5.1
Ethernet MII (100 Mbps)............................. 105
12.5.2
Ethernet MII (200 Mbps)............................. 107
12.5.3
Ethernet RMII..............................................109
12.5.4
Ethernet RGMII........................................... 111
12.5.5
MDIO timing specifications......................... 112
12.6
QuadSPI..................................................... 113
12.6.1
QuadSPI Quad 3.3V SDR 120MHz............ 113
12.6.2
QuadSPI Octal 3.3V DDR 100MHz............ 115
12.6.3
QuadSPI Octal 3.3V DDR 120MHz............ 116
12.7
uSDHC........................................................117
12.7.1
uSDHC SDR electrical specifications......... 117
12.7.2
uSDHC DDR electrical specifications......... 118
12.8
LPUART specifications............................... 120
13
Debug modules.............................................. 120
13.1
Debug trace timing specifications............... 120
13.2
SWD electrical specifications......................121
13.3
JTAG electrical specifications..................... 122
14
Thermal Attributes.......................................... 124
14.1
Description.................................................. 124
14.2
Thermal characteristics...............................125
15
Dimensions.....................................................127
15.1
Obtaining package dimensions...................127
16
Revision history.............................................. 127



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