Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19

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ZMD31020

Sensor Signal Conditioner

Datasheet

5.

DIE DIMENSIONS AND PAD COORDINATES

•

Die size (incl. scribeline): 3500µm x 3000µm = 10.5sqmm

•

Core die size (without scribeline): 3310µm x 2810µm ≈ 9.3sqmm

•

Die thickness: 390µm

•

Scribeline (distance between two core dice on wafer): 190µm

•

Pads size: 90µm x 90µm

5.1

Die Dimensions

1

2

3

4

5

6

7

14

13

12

11

10

9

8

3310µm

2810µm

0

x

y

ZMD31020

Core Die

with Pads

725µm