AL8116

Document number: DS42629 Rev. 2 - 2

4 of 13

www.diodes.com

April 2020

© Diodes Incorporated

AL8116

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) (Note 4)

Symbol

Parameter

Rating

Unit

VCC

Voltage at VCC Pin

-0.3 to +60

V

VOUT

Voltage at OUT Pin

-0.3 to +60

V

IOUT

OUT Sink Current

30

mA

VDIM

Voltage at DIM Pin

-0.3 to +20

V

VISET, VCLAMP

Voltages at ISET, CLAMP Pins

-0.3 to +6

V

TLEAD

Lead Temperature (Soldering, 10s)

+260

°C

TJ

Operating Junction Temperature

-40 to +150

°C

TST

Storage Temperature

-65 to +150

°C

—

ESD (Human Body Model)

2.5

kV

—

ESD (Charged-Device Model)

1000

V

Thermal Information (Note 5)

Package

θJC

Thermal Resistance

Junction-to-Case

θJA

Thermal Resistance

Junction-to-Ambient

PD

TA = +85°C

SOT26 (Type CJ)

60°C/W

240°C/W

200mW

Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) (Note 6)

Symbol

Parameter

Min

Max

Unit

VCC

Supply VCC Voltage

10

56

V

VOUT

Input Voltage on OUT Pin

—

56

V

TJ

Operating Junction Temperature

-40

+125

°C

RISET

Resistor of ISET Pin

33

330

kΩ

IDIM_SOURCE

Source Current of DIM Pin

—

300

μA

VDIM

Input Voltage of DIM Pin

0

13

V

fDIM

Input PWM Frequency of DIM Pin

0.5

5

kHz

CDIM

Capacitor of DIM Pin (CDIM) (Note 7)

330

1000

pF

RDIM

Resistance of DIM Pin (RDIM) (Note

7)

1

6.5

kΩ

—

PWM Signal Input Rising and Falling Time Rate

3

—

V/μs

VDIM_PWM_H

High Voltage Level PWM Signal Input on DIM Pin

3.2

13

V

VDIM_PWM_L

Low Voltage Level PWM Signal Input on DIM Pin

—

1.2

V

IOUT_SINK

Sink Current of OUT Pin

—

20

mA

TA

Ambient Temperature

-40

+105

°C

Notes:

4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.

Exposure to Absolute Maximum Ratings for extended periods can affect device reliability. All voltages unless otherwise stated and measured with

respect to GND.

5. Test condition: d

evice mounted on 1”

 1” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

6.

It’s essential to connect VCC pin with a SMD ceramic capacitor (0.1μF to 0.47μF) to filter out the undesired switching noise for stable operation.

This capacitor should be placed as close to IC as possible.

7. Test condition is RISET = 100k. (This mean is IDIM = 100μA).