TPD2017FN

2022-03-15

7

© 2022

Toshiba Electronic Devices & Storage Corporation

8. Absolute Maximum Ratings

Table 8.1 Absolute Maximum Ratings

(Ta = 25℃ unless otherwise specified)

Characteristics

Symbol

Rating

Unit

Supply voltage

VDD

−0.3 to 6.0

V

Input voltage

VIN

−0.3 to 6.0

V

Output withstand voltage

VOUT

50.01)

V

Output current

IOUT

Internally

limited

A

Power dissipation

(operation all channels, Ta=25℃ )

PD

1.8

W

Operating temperature

Topr

−40 to 110

°C

Junction temperature

Tj

150

°C

Storage temperature

Tstg

−55 to 150

°C

Note1: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and

the significant change in temperature, etc.) may cause this product to decrease in the reliability

significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within

the absolute maximum ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability

test report and estimated failure rate, etc).

1) Not subject to production test

8.1. Thermal Resistance

Table 8.2 Thermal resistance

Characteristics

Symbol

Rating

Unit

Thermal resistance

( junction to ambient )

Rth (j–a)

70

°C / W

Note:

JEDEC Standard.

Glass epoxy board

Material: FR-4(4 layer)

Board size: 76.2mmx114.3mmx1.6mm