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SST26VF016BEUI bảng dữ liệu(PDF) 51 Page - Microchip Technology

tên linh kiện SST26VF016BEUI
Giải thích chi tiết về linh kiện  16 Mbit Serial Quad I/O (SQI) Flash Memory with EUI-48™ and EUI-64™ Identifier
PDF  78 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SST26VF016BEUI bảng dữ liệu(HTML) 51 Page - Microchip Technology

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 2019 Microchip Technology Inc.
DS20006153A-page 51
SST26VF016BEUI
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
2.45
3.15
MILLIMETERS
1.27 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
1.60
0.60
NOM
12
8
C
Contact Pad Spacing
5.40
Contact Pad to Center Pad (X8)
G1
0.68
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-1136 Rev A
8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]
With 3.10x2.41 mm Exposed Pad
E
X1
Y1
Y2
X2
EV
EV
C
G1
ØV
G2
Contact Pad to Contact Pad (X6)
G2
0.67
SILK SCREEN



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