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MIC2133 bảng dữ liệu(PDF) 9 Page - Microchip Technology

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DS20006653B-page 9
MIC2133
TEMPERATURE SPECIFICATIONS
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Note 1
Maximum Junction Temperature
TJ(ABSMAX)
—
—
+150
°C
—
Storage Temperature
TS
-65
—
+150
°C
—
Lead Temperature
TLEAD
—
—
+300
°C
Soldering, 10s
Package Thermal Resistance
Thermal Resistance, 5 mm x 5 mm,
32-Lead VQFN
JC
—
2
—
°C/W
Junction to Case
Thermal Resistance, 5 mm x 5 mm,
32-Lead VQFN
JA
—
34
—
°C/W
Junction to Ambient
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.



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