AP64501

Document number: DS41980 Rev. 4 - 2

23 of 26

www.diodes.com

August 2019

© Diodes Incorporated

AP64501

Layout

PCB Layout

1.

The AP64501 works at 5A load current so heat dissipation is a major concern in the layout of the PCB. 2oz copper for both the top and

bottom layers is recommended.

2.

Place the input capacitors as closely across VIN and GND as possible.

3.

Place the inductor as close to SW as possible.

4.

Place the output capacitors as close to GND as possible.

5.

Place the feedback components as close to FB as possible.

6.

If using four or more layers, use at least the 2

nd and 3rd layers as GND to maximize thermal performance.

7.

Add as many vias as possible around both the GND pin and under the GND plane for heat dissipation to all the GND layers.

8.

Add as many vias as possible around both the VIN pin and under the VIN plane for heat dissipation to all the VIN layers.

9.

See Figure 31 for more details.

C5

EXPOSED PAD

BST

VIN

EN

SS

FB

COMP

GND

SW

C2

C3

R1

R2

R5

Css

VOUT

VIN

SW

GND

Figure 31. Recommended PCB Layout