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Ver1.0 Page: 11 of 11

SI N CE 198 1

●

Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the

LEDs within the rated figures. Also, caution should be taken not to overload LEDs with

instantaneous voltage at the turning ON and OFF of the circuit.

When using the pulse drive care must be taken to keep the average current within the

rated figures. Also, the circuit should be designed so as be subjected to reverse voltage

when turning off the LEDs.

●

Storage:

In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon

as possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪ Max.

(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase

reflow, or equivalent soldering process must be:

a. Completed within 168 hours.

b. Stored at less than 30% RH.

(3) Devices require baking before mounting, if:

2a or 2b is not met.

(4) If baking is required, devices must be baked under below conditions:

48 hours at 60℃±3℃.

● Package and Label of Products:

Package: Products are packed in one bag of 2000 pcs (one taping reel) and a label is attached to

each bag.

Label:

BRIGHT LED LOGO

Part No.

Quantity

BIN.

x

xx

xx

xx

Year Month Day

Manufacture Location

X X X X X

Sealing Date