www.sensirion.com / D1

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– October 2020

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5.2 Package Outline

Figure 9 Dimensional drawing of SHT4x including package tolerances (units mm).

5.3 Land Pattern

The land pattern is recommended to be designed according to the used PCB and soldering process

together with the physical outer dimensions of the sensor. For reference, the land pattern used with

Sensirion’s PCBs and soldering processes is given in Figure 10.

Soldering of the central die pad is optional. Sensirion recommends to not solder the central die pad

because the sensor can reach higher temperatures upon heater activation.

Figure 10: Recommended land pattern

(in mm). Details can vary and depend on

used PCBs and solder processes. There

shall be no copper under the sensor

other than at the pin pads.