APL5913 datasheet(4/19 Pages) ANPEC

4 / 19 page

Rev. A.4 - May., 2005

APL5913

www.anpec.com.tw

Absolute Maximum Ratings

Thermal Characteristics

Recommended Operating Conditions

Symbol

Parameter

Rating

Unit

VCNTL

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 7

VIN

VIN Supply Voltage (VIN to GND)

-0.3 ~ 3.3

VI/O

EN and FB to GND

-0.3 ~ VCNTL+0.3

VPOK

POK to GND

-0.3 ~ 7

Average Power Dissipation

PPEAK

Peak Power Dissipation (<20mS)

Junction Temperature

150

TSTG

Storage Temperature

-65 ~ 150

TSDR

Soldering Temperature, 10 Seconds

300

VESD

Minimum ESD Rating (Human Body Mode)

±2

Symbol

Parameter

Value

Unit

θJA

Junction-to-Ambient Thermal Resistance in Free Air (Note)

oC/W

Note :

θJA is measured with the component mounted on a high effective thermal conductivity test

board in free air. The exposed pad of SOP-8-P is soldered directly on the PCB.

Symbol

Parameter

Range

Unit

VCNTL

VCNTL Supply Voltage

3.1 ~ 6

VIN

VIN Supply Voltage

1.1 ~ 3.3

VOUT

Output Voltage

VCNTL=3.3

±5%

VCNTL=5.0

±5%

0.8 ~ 1.2

0.8 ~ VIN-0.2

IOUT

VOUT Output Current

0 ~ 4

Junction Temperature

-25 ~ 125

Electrical Characteristics

APL5913

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

SUPPLY CURRENT

ICNTL

VCNTL Nominal Supply Current

EN = VCNTL

0.4

ISD

VCNTL Shuntdown Current

EN = GND

180

300

µA

Refer to the typical application circuit. These specifications apply over, VCNTL = 5V, VIN = 1.5V, VOUT = 1.2V and TA = 0

to 70

°C, unless otherwise specified. Typical values refer to TA = 25°C.

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