công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

FXPS7115D4 bảng dữ liệu(PDF) 60 Page - NXP Semiconductors

tên linh kiện FXPS7115D4
Giải thích chi tiết về linh kiện  Digital absolute pressure sensor, 40 kPa to 115 kPa
PDF  75 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
nhà sản xuất  NXP [NXP Semiconductors]
Trang chủ  http://www.nxp.com
Logo NXP - NXP Semiconductors

FXPS7115D4 bảng dữ liệu(HTML) 60 Page - NXP Semiconductors

Back Button FXPS7115D4 Datasheet HTML 56Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 57Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 58Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 59Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 60Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 61Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 62Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 63Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 64Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 60 / 75 page
background image
NXP Semiconductors
FXPS7115D4
Digital absolute pressure sensor, 40 kPa to 115 kPa
aaa-029734
temperature (°C)
130
85
25
-20
0
-40
0
-1.0
1.0
2.0
1.75
-1.75
absolute
pressure
error
(kPa)
-2.0
absolute pressure accuracy
= ± 1.25 kPa from 0°C - 85°C
Figure 23. Absolute pressure accuracy as a function of temperature
Figure 24. Absolute pressure accuracy multiplier over life
14 Application information
The FXPS7115D4 sensor can operate in two modes: I2C and SPI. The application
diagrams in Figure 25 and Figure 26 show the modes and their respective biasing and
bypass components.
The sensor can be configured to operate in SPI mode to read the user registers, self-test
and diagnostics information. The application diagram in Figure 26 shows the SPI and the
respective biasing and bypass components.
Note: A gel is used to provide media protection against corrosive elements which
may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas
molecules may permeate through the gel and then occupy boundaries between material
surfaces within the sensor package. When decompression occurs, the gas molecules
may collect, form bubbles and possibly result in delamination of the gel from the material
it protects. If a bubble is located on the pressure transducer surface or on the bond wires,
FXPS7115D4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2022. All rights reserved.
Product data sheet
Rev. 6 — 6 June 2022
60 / 75



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75


bảng dữ liệu tải về

Go To PDF Page


Link URL



Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không?  [ DONATE ] 

Alldatasheet là   |   Quảng cáo   |   Liên lạc với chúng tôi   |   Chính sách bảo mật   |   Liên kết đến bảng dữ liệu    |   Trao đổi link   |   Tìm kiếm theo nhà sản xuất
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com