4

Technical Data ELX1177

Effective June 2022

MFFA

4-terminal SMD current sensing resistor-metal strip

www.eaton.com/electronics

General specifications

Insulation resistance: > 100 MΩ

Temperature coefficient of resistance: IEC60115-1 4.8, +25 °C to +125 °C

Short time overload: IEC60115-1 4.13, 5 X rated power for 5 s

High temperature exposure (storage): AEC-Q200-REV D-test 3, MIL-STD202 Method 108, 1000 hours. @ +170 °C.

Temperature cycling: AEC-Q200-REV D-Test 4, JESD22 Method JA-104, 1000 cycles (-55 °C to +125 °C), 30 minute maximum dwell time at each temperature extreme. 1 minute

maximum transition time.

Moisture resistance: AEC-Q200-REV D-Test 6 , MIL-STD-202 method 106, 24 hours per cycle, 10 cycles, Notes: Steps 7a& 7b not required. Unpowered

Biased humidity: AEC-Q200-REV D-Test 7, MIL-STD-202 method 103, 1000 hours +85 °C/85% RH. Note: Specified conditions: 10% of operating power (not exceeding max

working voltage).

Operational life: AEC-Q200-REV D-Test 8, MIL-STD-202 method 108, 1000 hours, +125 °C at rated derating power.

Resistance to solvents: AEC-Q200-REV D-Test 12, MIL-STD-202 method 215, a: Isopropyl alcohol : mineral spirits= 1 : 3, b: Terpene defluxer (Bioact EC-7R) c: Deionized water :

Propylene glycol Monomethyl ether : monoethanolamine = 42 : 1

Mechanical shock: AEC-Q200-REV D-Test 13, MIL-STD-202 Method 213, half sine shock pulse, peak value is 100 g’s. Normal duration (D) is 6 (ms)

Vibration: AEC-Q200-REV D-Test 14, MIL-STD-202 method 204, 5 g’s for 20 minutes, 12 cycles each of 3 orientations. Test from 10-2000 Hz

Resistance to soldering heat: AEC-Q200-REV D-Test 15, MIL-STD-202 method 210, Condition B : Immerse in eutectic solder at +260 °C ± 5 °C for 10 ± 1 second

Thermal shock: AEC-Q200-REV D-Test 16, MIL-STD-202 method 107, -55 °C/+155 °C. 300 cycles, Maximum transfer time 20 seconds, Dwell time 15 minutes. Air-Air

ESD: AEC-Q200-REV D-Test 17, AEC-Q200-002 or ISO/DIS 10605, verify the voltage setting at 500 V

Solderability: AEC-Q200-REV D-Test 18, J-STD-002, method B, aging 4 hours at +155 °C dry heat Lead-free solder bath at +235 °C ± 3 °C, Dipping time: 3 ± 0.5 seconds, > 95% area

covered with tin

Flammability: AEC-Q200-REV D-Test 20, UL-94, V-0 or V-1 are acceptable.

Board flex (bending): AEC-Q200-REV D-Test 21, AEC-Q200-005, The duration of the applied forces shall be 60 (+ 5) seconds, 2 mm deflection

Terminal strength (SMD): AEC-Q200-REV D-Test 22, AEC-Q200-006, Force of 1.8 kg for 60 seconds