36.0-43.0 GHz GaAs MMIC

Buffer Amplifier

Page 3 of 6

Mechanical Drawing

Bias Arrangement

(Note: Engineering designator is 38BSA_01B1)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.691 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (Vd2)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg2)

Bond Pad #6 (Vg1)

Bypass Capacitors - See App Note [2]

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

April 2005 - Rev 01-Apr-05

B1002

RF

In

RF

Out

XB1002

2

3

4

5

6

1

1.150

(0.045)

1.750

(0.069)

0.750

(0.030)

0.0

0.0

1.150

(0.045)

1.750

(0.069)

2.900

(0.114)

0.750

(0.030)

1.500

(0.059)

2

3

4

5

6

1

Vd1,2

RF In

RF Out

Vg1,2