11

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard

F3122_R46_X2_310_125C • 10/31/2022

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Metallized Polypropylene Film EMI Suppression Capacitors

R46, Class X2, 310 VAC, 125°C

Soldering Process cont.

Wave Soldering Recommendations cont.

1. The table indicates the maximum set-up temperature of the soldering process.

Dielectric

Film Material

Maximum

Preheat

Temperature

Maximum

Peak Soldering

Temperature

Capacitor

Pitch

≤ 15 mm

Capacitor

Pitch

> 15 mm

Capacitor

Pitch

≤ 15 mm

Capacitor

Pitch

> 15 mm

Polyester

130°C

130°C

270°C

270°C

Polypropylene

125°C

130°C

260°C

270°C

Paper

130°C

140°C

270°C

270°C

Polyphenylene

Sulphide

150°C

160°C

270°C

270°C

2. The maximum temperature measured inside the capacitor: set the temperature so that the maximum temperature inside

the element is below the limit.

Dielectric Film Material

Maximum Temperature

Measured Inside the Element

Polyester

160°C

Polypropylene

125°C

Paper

160°C

Polyphenylene Sulphide

160°C

Temperature monitored inside the capacitor.

Selective Soldering Recommendations

Selective dip soldering is a variation of reflow soldering. In this method, the printed circuit board with through-hole

components to be soldered is preheated and transported over the solder bath as it is in normal flow soldering, without

touching the solder. When the board is over the bath, it is stopped. Pre-designed solder pots are lifted from the bath with

molten solder, only at the places of the selected components, and pressed against the lower surface of the board to solder

the components.

The temperature profile for selective soldering is similar to the double wave flow soldering outlined in this document.

However, instead of two baths, there is only one with a time from 3 – 10 seconds. In selective soldering, the risk of

overheating is greater than in double wave flow soldering, and great care must be taken so that the parts do not overheat.