SMAJ_V01 datasheet(5/10 Pages) STMICROELECTRONICS

5 / 10 page

SMAJ

Characteristics

Doc ID 5544 Rev 12

5/10

Figure 6.

Junction capacitance versus

reverse applied voltage for

unidirectional types (typical values)

Figure 7.

Junction capacitance versus

reverse applied voltage for

bidirectional types (typical values)

100

1000

10000

100

1000

C(pF)

F=1 MHz

VOSC=30 mVRMS

Tj=25 °C

SMAJ5.0A

SMAJ12A

SMAJ24A

SMAJ40A

SMAJ85A

SMAJ188A

VR(V)

100

1000

10000

100

1000

C(pF)

F=1 MHz

OSC=30 mVRMS

j=25 °C

SMAJ5.0CA

SMAJ12CA

SMAJ24CA

SMAJ40CA

SMAJ85CA

SMAJ188CA

VR(V)

Figure 8.

Peak forward voltage drop

versus peak forward current

(typical values)

Figure 9.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 10. Thermal resistance, junction to

ambient, versus copper surface

under each lead

Figure 11. Leakage current versus junction

temperature (typical values)

FM(A)

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

j =25 °C

j =125 °C

VFM(V)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

th(j-a) /Rth(j-a)

Recommended pad layout

PCB FR4, copper thickness = 35 µm

tP(s)

(°C/W)

th(j-a)

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCU(cm²)

PCB FR4, copper thickness = 35 µm

IR(nA)

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

100

125

150

R=VRM

RM ≥ 10 V

R=VRM

RM <10 V

Tj(°C)

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