t

KTZ8866

January 2022 - Revision 04b

Page 5 of 37

Company Confidential

Absolute Maximum Ratings1

(TA = 25

C unless otherwise noted)

Symbol

Description

Value

Units

VIN

Input Voltage

-0.3 to 6

V

LX_BL

LX_BL to GND DC

-0.3 to 42

V

LX_BL to GND AC Transient: 100 ns

-1.0 to 44

V

VOUT

LED Backlight driver output node

-0.3 to 42

V

S1, S2, S3, S4, S5, S6

LED Backlight driver current sink

-0.3 to 32

V

HWEN, SCL, SDA, PWM,

ENP, ENN

Control Pins

-0.3 to VIN+0.3

V

LX_LCD, CFLY1, OUTP, REG

LCD Bias power positive voltage and switching node

-0.3 to 7

V

OUTN, CFLY2

LCD Bias power negative output voltage and

switching node

-7 to 0.3

V

TJ

Junction Operating Temperature Range

-40 to 150

°C

TS

Storage Temperature Range

-65 to 150

°C

TLEAD

Maximum Soldering Temperature (at leads, 10 sec)

300

°C

ESD

HBM Electrical Static Discharge

2.0

kV

ESD Ratings

Symbol

Description

Value

Units

VESD

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

±2000

V

Charge device model (CDM), per JEDEC specification JESD22-C101

±500

V

Thermal Capabilities2

Symbol

Description

Value

Units

θJA

Thermal Resistance

– Junction to Ambient

66.8

C/W

PD

Maximum Power Dissipation at TA

≤ 25°C

1870

mW

ΔPD/ΔT

Derating Factor Above TA = 25°C

-14.97

mW/°C

Ordering Information

Part Number

Marking3

Operating

Temperature

Package

KTZ8866EKAA-TR

PRXXYYZZZZ

-40°C to +85°C

WLCSP-28

1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device.

Functional operation at

conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one

time.

2. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when

soldered to an EV board.

3. PR = Device ID Code, XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number.