www.statschippac.com

FEATURES

• Body Sizes: 14 x 14mm to 32 x 32mm

• Package Height: 2.0mm to 3.4mm (same as QFP)

• Lead Counts: 64L to 240L

• Lead Pitch: 0.80mm to 0.50mm

• Moisture Sensitivity: JEDEC Level 3

• Wide range of open tool leadframe and die pad sizes

available

• JEDEC standard compliant

• Lead-free and Green material sets available

APPLICATIONS

• ASIC

• DSP

• FPGA

•PLD

• High speed logic, high power microprocessors /

controllers

• 3D graphics, telecom, wireless, audio, CPU / GUI

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• 14 x 14mm to 32 x 32mm

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• 64 to 240 lead count

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• Lead pitch range from 0.80mm

to 0.50mm

DESCRIPTION

STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack

(MQFP-d) is a thermally enhanced version of the QFP

package. Thermal enhancement is achieved by an embedded

anodized aluminum heat spreader which is dropped in

during the mold process. This process allows the use of

standard leadframe while offering an added margin of

thermal performance for high power applications. The

QFP-d package offers 30% improvement (typical) in thermal

performance over standard MQFP packages.

MQFP-d

Heat Spreader Metric Quad Flat Pack