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MPXV6115VC6U bảng dữ liệu(PDF) 3 Page - Freescale Semiconductor, Inc

tên linh kiện MPXV6115VC6U
Giải thích chi tiết về linh kiện  High Temperature Accuracy ntegrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  8 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXV6115VC6U bảng dữ liệu(HTML) 3 Page - Freescale Semiconductor, Inc

  MPXV6115VC6U Datasheet HTML 1Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 2Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 3Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 4Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 5Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 6Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 7Page - Freescale Semiconductor, Inc MPXV6115VC6U Datasheet HTML 8Page - Freescale Semiconductor, Inc  
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MPXV6115VC6U
Sensors
Freescale Semiconductor
3
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
Figure 2 illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85
°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The
MPXV6115VC6U pressure sensor operating characteristics,
internal reliability and qualification tests are based on use of
dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluorosilicone
Gel Die Coat
Wire
Bond
Differential Sensing
Element
Thermoplastic
Case
Stainless
Steel Cap
Lead
Frame
P1
P2
Die Bond
Die
VS Pin 2
+5.0 V
GND Pin 3
Vout Pin 4
MPXV6115VC6U
to ADC
100 nF
51 K
47 pF
Max
Transfer Function:
Vout = VS*[(0.007652*P) + 0.92] ± (Pressure error)
Min
Vout vs. Vacuum
Transfer Function MPXV6115VC6U
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
*Temp Factor*0.007652*VS)
VS = 5.0 V ± 0.25 Vdc
TEMP = 0-85
° C
-115
-95
-75
-55
-35
-15
0



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