SOIC−14 NB

CASE 751A−03

ISSUE L

DATE 03 FEB 2016

SCALE 1:1

1

14

GENERIC

MARKING DIAGRAM*

XXXXXXXXXG

AWLYWW

1

14

XXXXX = Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

Y

= Year

WW

= Work Week

G

= Pb−Free Package

STYLES ON PAGE 2

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

H

14

8

7

1

M

0.25

B M

C

h

X 45

SEATING

PLANE

A1

A

M

_

S

A

M

0.25

B S

C

b

13X

B

A

E

D

e

DETAIL A

L

A3

DETAIL A

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

D

8.55

8.75

0.337

0.344

E

3.80

4.00

0.150

0.157

A

1.35

1.75

0.054

0.068

b

0.35

0.49

0.014

0.019

L

0.40

1.25

0.016

0.049

e

1.27 BSC

0.050 BSC

A3

0.19

0.25

0.008

0.010

A1

0.10

0.25

0.004

0.010

M

0

7

0

7

H

5.80

6.20

0.228

0.244

h

0.25

0.50

0.010

0.019

__

_

_

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.10

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

98ASB42565B

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 2

SOIC−14 NB

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