Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

Eaton.com/electronics

© 2020 Eaton

All Rights Reserved

Printed in USA

Publication No. 2543 BU-MC20075

April 2020

Technical Data 2543

Effective April 2020

AGC

1/4” x 1-1⁄4” Fast-acting glass tube fuses

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used

in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Time

Tsmin

Tsmax

Tstyp

Tp

tp

First Wave

Second Wave

Preheat area

Cool down area

Wave solder profile (Axial lead only)

Reference EN 61760-1:2006

Profile feature

Standard SnPb solder

Lead (Pb) free solder

Preheat

• Temperature min. (Tsmin)

100 °C

100 °C

• Temperature typ. (Tstyp)

120 °C

120 °C

• Temperature max. (Tsmax)

130 °C

130 °C

• Time (Tsmin to Tsmax) (ts)

70 seconds

70 seconds

D preheat to max Temperature

150 °C max.

150 °C max.

Peak temperature (TP)*

235 °C – 260 °C

250 °C – 260 °C

Time at peak temperature (tp)

10 seconds max

5 seconds max each wave

10 seconds max

5 seconds max each wave

Ramp-down rate

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

Time 25 °C to 25 °C

4 minutes

4 minutes

Manual solder

+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended

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