microComp® Series

3

Contents

Overview ................................................................................................................................................................................................. 4

Features and benefits ....................................................................................................................................................................5 - 6

Comparison with high density D-Sub ............................................................................................................................................ 7

Comparison with micro-D .................................................................................................................................................................. 8

Technical Features ........................................................................................................................................................................ 9 -12

Weight - Mating Forces ......................................................................................................................................................................12

Contact layouts ....................................................................................................................................................................................13

Contact types ........................................................................................................................................................................................14

Ordering information ..........................................................................................................................................................................15

Crimp removable contacts ..............................................................................................................................................................16

Mating dimensions and contact position .....................................................................................................................................17

Wiring instructions .................................................................................................................................................................... 17 - 18

Dimensions .................................................................................................................................................................................19 - 21

Mounting operations and hardware ....................................................................................................................................22 - 27

Mounting hardware ...................................................................................................................................................................28 - 31

Hermetic feedthrough ............................................................................................................................................................ 32 - 34

EMI Backshells .......................................................................................................................................................................... 35 - 38

Dust Caps .............................................................................................................................................................................................39

Under development ..........................................................................................................................................................................40