Quectel AF20

Wi-Fi & BT* Module with

Ultra-compact LGA Package

Build a Smarter World

Quectel AF20 is a cost-effective Wi-Fi & BT* module with high performance. The ultra-compact 17.2mm × 15.2 mm × 2.2mm

profile makes it a perfect choice for size sensitive applications. The compact and unified form factor can also help customers

reduce product sizes and cut costs.

Surface-mount technology (SMT) makes AF20 an ideal solution for durable and rugged designs. The compact LGA package

makes sure AF20 can be easily embedded into size-constrained applications and provide reliable connectivity with these

applications. The advanced package allows for large-scale automated manufacturing which has strict requirements on cost

and efficiency.

Combining advantages such as compact form factor, low power consumption, extended temperature range and stable SDIO

interface, AF20 is typically used in combination with Quectel automotive grade LTE module AG35 to serve a wide range of

M2M applications, especially automotive industry application.

Ultra-compact Wi-Fi & BT* module

Support BT 4.2* technology

Support IEEE802.11a/b/g/n/ac standards

Easier soldering and testing process with LGA package

Stable and reliable SDIO communication interface

Fast time-to-market: simple design minimizes design-in time and

development efforts

EMAIL US: info@quectel.com

VISIT US: www.quectel.com

LGA Package

BT 4.2*

IEEE 802.11

a/b/g/n/ac

Ultra-compact

Size

Key

Benefits

Extended Temperature

Range: -40°C ~ +85°C

SDIO

Interface

Rev.: V1.0 | Status: Released