AP7381

Document number: DS39917 Rev. 3 - 2

2 of 13

www.diodes.com

February 2020

© Diodes Incorporated

AP7381

Typical Applications Circuit

VIN

GND

VOUT

COUT

2.2µF

VOUT

VIN

AP7381

CIN

1µF

Pin Descriptions

Pin Number

Pin Name

Function

TO92 (Ammo Packing)

SOT89

SOT23

3

3

1

VIN

Input voltage

2

2

3

GND

Ground

1

1

2

VOUT

Regulated output voltage

Absolute Maximum Ratings (Note 4)

Symbol

Parameter

Rating

Unit

VIN

Supply Input Voltage

-0.3 to 45

V

VOUT

Output Voltage

-0.3 to 8

V

IOUT

Output Current

150

mA

TLEAD

Lead Temperature (Soldering, 10s)

+260

ºC

TJ

Operating Junction Temperature

+150

ºC

θJA

Thermal Resistance

SOT89

125

°C/W

TO92 (Ammo Packing)

165

SOT23

167

TSTG

Storage Temperature Range

-65 to +150

ºC

CDM

ESD (Change Device Model)

2000

V

HBM

ESD (Human Body Model)

4000

V

Note:

4.

a). Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods can

affect device reliability.

b). Ratings apply to ambient temperature at +25°C. The JEDEC High-K board design used to derive this data is a 2inch × 2inch multi-layer board with

1oz internal power and ground planes and 2oz copper traces on the top and bottom of the board.

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

VIN

Supply Input Voltage

3.3

40

V

TJ

Operating Junction Temperature

-40

+125

°C