SFH4655 datasheet(8/8 Pages) OSRAM

8 / 8 page

2005-03-088

Vorl

äufige Daten / Preliminary Data

SFH 4650, SFH 4655

ötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions

Preconditioning acc. to JEDEC Level 2

IR-Reflow L

ötprofil für bleifreies Löten

(nach J-STD-020B)

IR Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020B)

Verarbeitungshinweis: Das Geh

äuse ist mit Silikon vergossen. Mechanischer Streß auf der

Bauteiloberfl

äche sollte so gering wie möglich gehalten werden.

Handling indication:

The package is casted with silicone. Mechanical stress at the surface of

the unit should be as low as possible.

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you

– get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components

1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

OHLA0687

120 s max

100

150

200

250

300

Ramp Up

100 s max

100

150

200

250

300

Ramp Down

6 K/s (max)

3 K/s (max)

30 s max

Maximum Solder Profile

Recommended Solder Profile

Minimum Solder Profile

10 s min

min. condition for IR Reflow Soldering:

solder point temperature

235

°C for at least 10 sec.

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