Rev Date: 08/29/2019

6

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This specification may be changed at any time without prior notice.

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Please confirm technical specifications before you order and/or use.

LDRS Series

SMD Shielded Power Inductor

Stackpole Electronics, Inc.

Resistive Product Solutions

Reflow Chart:

RoHS Compliance

Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various

regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances”

(RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our

compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as

amended by Directive (EU) 2015/863/EU as regards the list of restricted substances.

Environmental Specifications - General

Environmental Tests

Mechanical Tests

Test

Test Specification

Test Condition

Temperature 85±2°C

Time: 48 ± 2 hours

Tested after 1 hour at room temperature

Temperature -40±2°C

Time: 48 ± 2 hours

Tested after 1 hour at room temperature

Temperature 40±2°C, 90~95% relative humidity

Time: 96 ± 2 hours

Tested after 1 hour at room temperature

Tested after 1 hour at room temperature

First -25°C 30 minutes, then 25°C 10 minutes, last 85°C

30 minutes, as 1 cycle. Go through 5 cycles.

High Temperature Storage Test

No case deformation or change in

appearance.

Δ L/L ≤

10%

Low Temperature Storage Test

Humidity Test

Thermal Shock Test

Test

Test Specification

Test Condition

Vibration Test

Apply frequency 10~55Hz 1.5mm amplitude in each of

perpendicular direction for 2 hours

Shock Resistance

Drop down with 981m/s

2 (100G) shock attitude upon a

rubber block method shock testing machine for

1 time in each of three orientations.

No case deformation or change in

appearance

Δ L/L ≤10%

Solderability Test

Terminal area must have 90%

minimum solder coverage

Product with lead-free terminal

Dip pads in flux then dip in solder pot (SnCuNi) at 245±5°C

for 3 seconds

Resistance to Soldering Heat

No case deformation or change in

appearance

Flux should cover the whole of the sample before heating, then be

preheated for about 2 minutes over temperature of 130~150°C.

immersing to 260±5°C for 10 seconds

Item

Specification

Temperature range: 25±3°C. Humidity: <80% relative humidity.

Recommended product should be used within six months from the time of delivery.

Shelf Storage Conditions