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MCBF3JB33R0 bảng dữ liệu(PDF) 3 Page - Stackpole Electronics, Inc.

tên linh kiện MCBF3JB33R0
Giải thích chi tiết về linh kiện  Ceramic Housed with Axial Leads Power Resistor
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nhà sản xuất  SEI [Stackpole Electronics, Inc.]
Trang chủ  https://www.seielect.com/
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MCBF3JB33R0 bảng dữ liệu(HTML) 3 Page - Stackpole Electronics, Inc.

  MCBF3JB33R0 Datasheet HTML 1Page - Stackpole Electronics, Inc. MCBF3JB33R0 Datasheet HTML 2Page - Stackpole Electronics, Inc. MCBF3JB33R0 Datasheet HTML 3Page - Stackpole Electronics, Inc. MCBF3JB33R0 Datasheet HTML 4Page - Stackpole Electronics, Inc.  
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Rev Date: 4/13/2021
3
www.seielect.com
This specification may be changed at any time without prior notice.
marketing@seielect.com
Please confirm technical specifications before you order and/or use.
CB / MCB Series
Ceramic Housed with Axial Leads Power Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
RoHS Compliance
Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various
regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances”
(RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our
compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as
amended by Directive (EU) 2015/863/EU as regards the list of restricted substances.
RoHS Compliance Status
CB
General Purpose Ceramic Housed with
Axial Leads Wirewound Resistor
Axial
YES
100% Matte Sn
Jan-06
06/01
MCB
Ceramic Housed General Purpose
Metal Oxide Element Resistor
Axial
YES
100% Matte Sn
Jan-06
06/01
Lead-Free
Effective Date
Code
(YY/WW)
Standard
Product
Series
Description
Package /
Termination
Type
Standard
Series RoHS
Compliant
Lead-Free Termination
Composition
Lead-Free
Mfg. Effective Date
(Std Product Series)
Recommended Lead Free Resistor Reflow Profile
Wave Soldering
Description
Maximum
Recommended
Minimum
Preheat Time
80 seconds
70 seconds
60 seconds
Temperature Diff.
140°C
120°C
100°C
Solder Temp.
260°C
250°C
240°C
Dwell Time at Max.
10 seconds
5 seconds
*
Ramp DN (°C/sec)
N/A
N/A
N/A
Temperature Diff. = Defference between final preheat stage and soldering stage.
Convection IR Reflow
Description
Maximum
Recommended
Minimum
Ramp Up (°C/sec)
3°C/sec
2°C/sec
*
Dwell Time > 217°C
150 seconds
90 seconds
60 seconds
Solder Temp.
260°C
245°C
*
Dwell Time at Max.
30 seconds
15 seconds
10 seconds
Ramp DN (°C/sec)
6°C/sec
3°C/sec
*



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