6

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

6.1

Soldering information

The RHLGA (3.5 x 2.65 x 0.98) mm package is also compliant with the RoHS and “Green” standards and is

qualified for soldering heat resistance according to JEDEC J-STD-020.

Landing pattern and soldering recommendations are available at www.st.com.

Figure 11. Recommended soldering profile limits

T25°C to PEAK

RAMP-DOWN

RAMP-UP

ts

PREHEAT

tL

tp

CRITICAL ZONE

TL to TP

TSMAX

TSMIN

TIME

TP

TL

30

60

90

120

150

180

210

240

270

300

330

360

390

Table 8. Recommended soldering profile limits

Description

Parameter

Pb free

Average ramp rate

TL to TP

3 °C/sec max

Preheat

Minimum temperature

TSMIN

150 °C

Maximum temperature

TSMAX

200 °C

Time (TSMIN to TSMAX)

tS

60 sec to 120 sec

Ramp-up rate

TSMAX to TL

Time maintained above liquidus temperature

Liquidus temperature

tL

TL

60 sec to 150 sec

217 °C

Peak temperature

TP

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

MP23DB02MM

Package information

DS13521 - Rev 3

page 10/15