DocID031167 Rev 6

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MP23ABS1

Reliability tests

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Reliability tests

The device passed all reliability tests on three different assembly lots under the following conditions

given in the table below.

Table 7. Reliability specifications

Test name

Description

Conditions

Electrostatic Discharge

Immunity Test

(ESD)

To classify ESD susceptibility

the device is submitted to a high

voltage peak on all his pins,

simulating ESD stress according

to different simulation models

(GUN, HBM, MM, CDM)

ESD-GUN: 25 discharges at ±8 kV, direct contact

to housing of MIC

Reference specification IEC 61000-4-2

ESD-HBM 3 discharges up to ±2 kV pin-to-pin

Reference specification ANSI/ESDA/JEDEC JS001

ESD-MM, 3 discharges up to ±200 V pin-to-pin

Reference specification JEDEC JESD22-A115C

ESD-CDM, 3 discharges up to ±750 V

Reference specification ANSI/ESDA/JEDEC JS002

Latch-Up

(LU)

To verify latch-up immunity the

device is submitted to a current

injection on I/O or supply

overvoltage

±100 mA & 1.5 x Vdd @ 85 °C

Reference specification JEDEC JESD78

High Temperature

Operative Life

(HTOL)

To simulate the worst-case

application stress conditions, the

device is stressed in dynamic

configuration at operative max.

absolute ratings

Ta 125 °C, Tj 125 °C, 1000 Hrs, @ Max Op Voltage

Preconditioning (PC) before

Reference specification JESD22-A108

Temperature Humidity

Bias

(THB)

To investigate failure

mechanisms activated by

electrical field and humidity, the

device is biased in static or

dynamic operative conditions at

controlled high temperature and

relative humidity

Ta 85°C, R.H. 85%, 1000 Hrs, @ Max Op Voltage

Preconditioning (PC) before

Reference specification JESD22-A101

Preconditioning MSL3

(PC)

To investigate effects of

customer manufacturing

soldering enhanced by package

water absorption, the device is

submitted to typical temperature

profile after controlled moisture

absorption

MSL3 as moisture soak conditions followed by n.3

reflow @ Tpeak 260 °C

Reference specification JEDEC J-STD-020

Low Temperature Storage

(LTS)

To investigate the failure

mechanisms activated by

extremely cold conditions, the

device is stored in unbiased

condition at the min.

temperature allowed by the

package materials

Ta = -40 °C, 1000 Hrs

Reference specification JESD22-A120