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A1P35S12M3 bảng dữ liệu(PDF) 1 Page - STMicroelectronics

tên linh kiện A1P35S12M3
Giải thích chi tiết về linh kiện  ACEPACKTM 1 sixpack topology, 1200 V, 35 A, trench gate field‑stop M series IGBT with soft diode and NTC
PDF  15 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

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ACEPACK™ 1
Features
•
ACEPACK™ 1 power module
–
DBC Cu Al2O3 Cu
•
Sixpack topology
–
1200 V, 35 A IGBTs and diodes
–
Soft and fast recovery diode
•
Integrated NTC
Applications
•
Inverters
•
Industrial
•
Motor drives
Description
This power module is a sixpack topology in an ACEPACK™ 1 package with NTC,
integrating the advanced trench gate field-stop technologies from
STMicroelectronics. This new IGBT technology represents the best compromise
between conduction and switching loss, to maximize the efficiency of any converter
system up to 20 kHz.
Product status
A1P35S12M3
Product summary
Order code
A1P35S12M3
Marking
A1P35S12M3
Package
ACEPACK™ 1
Leads type
Solder contact pins
ACEPACK™ 1 sixpack topology, 1200 V, 35 A,
trench gate field
‑stop M series IGBT with soft diode and NTC
A1P35S12M3
Datasheet
DS11635 - Rev 5 - November 2018
For further information contact your local STMicroelectronics sales office.
www.st.com


Số phần tương tự - A1P35S12M3

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
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Mô tả tương tự - A1P35S12M3

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