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CODACA ELECTRONIC CO., LTD
TEL
: +86 755 89585372
FAX
: +86 755 89585280
http://www.codaca.com
E-mail: info@codaca.com
Molding Power Choke
CSHB0530R Series
This product is not authorized for use in any application related to safety.
Specification subject to change without notice. Please check web site for latest information.
Revised: 07/14/2020
6 Soldering Specification
6.1 Reflow Profile for SMT Components
6.2 Classification of Peak Package Body Temperature (TP)
Package Thickness
Package Volume
<350 mm
3
350
～2000 mm3
>2000 mm
3
PB-Free Assembly
<1.6mm
260
℃
260
℃
260
℃
1.6
～2.5mm
260
℃
250
℃
245
℃
≥2.5mm
250
℃
245
℃
245
℃
※ Reflow is referred to standard IPC/JEDEC J-STD-020D.
480s Max.
(Time of 25℃ to peak temperature)
25
Preheat Area
TS Max.
200
℃
TS Min.
150
℃
tS
60～120s
Max. Ramp Up Rate = 3
℃/s
Max. Ramp Down Rate = 6
℃/s
TP
TL
217
℃
TC
-5
℃
tP
20～30s
tL
60～150s
T(
℃)
t(
s)
Time
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