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Vishay Electro-Films

Revision: 14-Sep-2018

4

Document Number: 61112

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

MULTILAYER AND AIR BRIDGE

For certain complex designs multiple layers of metal and / or interlevel dielectrics are required. Vishay Electro-Films has

developed precision patterning and layering techniques where ± 0.0001" pattern tolerance and ± 0.0005" layer to layer

alignment is achievable.

For Multilayer designs that require an interlevel dielectric the following two choice are currently available:

Note

In applications where lange couplers and cross-metal patterning are needed, air bridges can be used to connect different metal

patterns using polyimide supported bridges. These bridges require several design guidelines for layering the base metal,

polyimide, and bridge metal into the optimum air bridge design.

Fig. 3 can be used as a guideline for a typical lange coupler / air bridge set-up. The dimensions listed in the bubble detail picture

are considered minimums for any design. For more specific design layout guidelines, contact the factory for more information.

Note

• These rules apply to the non-vented via side

Fig. 3

DIELECTRIC

TYPICAL THICKNESS

PATTERN TOLERANCE

DIELECTRIC CONSTANT

4000 Å to 6000 Å

± 0.002"

-

Polyimide

50 000 Å to 80 000 Å

± 0.002"

3.2 at 1 MHz

MULTI-LEVEL CROSSOVER DESIGN PARAMETERS

PARAMETER

MINIMUM VALUE

(in μm)

COMMENTS

Dimension

Crossover thickness

0.0001 (2.5)

Minimum

A

Crossover width

0.001 (25)

0.0001 in crossover to conductor pullback

B

Crossover length

0.003 (75)

Minimum

C / D

Insulator dimension

Length: 0.0015 (37.5)

Width: 0.003 (76)

0.0025 (63)

insulator-to-conductor overlap

Insulator material

Polyimide

E / F

Encapsulation dimension

Crossover width: +0.0015 (37.5)

Crossover length: +0.003 (76)

These values are added to the

insulator dimension

Encapsulation material

Polyimide

E

D

B

C

A

F