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Vishay Dale Thin Film

Revision: 18-Mar-2021

2

Document Number: 60157

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

•

where k is the thermal conductivity of AIN, 170 W/mK

DIMENSIONS in inches

CASE SIZE

L

W

T

D

0603

0.061 ± 0.005

0.033 ± 0.005

0.030 ± 0.005

0.015 ± 0.005

0612

0.063 ± 0.005

0.126 ± 0.005

0.030 ± 0.005

0.015 ± 0.005

0805

0.079 ± 0.005

0.047 ± 0.005

0.030 ± 0.005

0.020 ± 0.005

1206

0.126 ± 0.005

0.063 ± 0.005

0.030 ± 0.005

0.020 ± 0.005

1225

0.126 ± 0.005

0.252 ± 0.005

0.030 ± 0.005

0.020 ± 0.005

2512

0.252 ± 0.005

0.126 ± 0.005

0.030 ± 0.005

0.020 ± 0.005

TYPICAL CHARACTERISTICS

CASE SIZE

0603

0612

0805

1206

1225

2512

14413

15415

70

259

77

65

259

65

Capacitance (pF)

0.07

0.26

0.15

0.07

0.26

0.07

> 1.5

> 1.5

> 1.5

> 1.5

> 1.5

> 1.5

STANDARD ELECTRICAL SPECIFICATIONS

TEST

SPECIFICATIONS

Operating temperature range

-65 °C to +150 °C

Storage temperature range

-65 °C to +150 °C

STANDARD MATERIAL SPECIFICATIONS

Substrate material

Aluminum nitride (170 W/mK)

Termination (tin / lead)

Electroplate tin / lead over electroplate nickel

Termination (lead (Pb)-free)

Electroplate tin (e3) over electroplate nickel

ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 / AEC-Q200 Requirements)

ENVIRONMENTAL TEST

CONDITIONS

LIMITS

TYPICAL VISHAY

PERFORMANCE

Solderability

Visual

J-STD-002, method B and B1

95 %

Acceptable

Solder mounting integrity

Visual

MIL-PRF-55342, method par. 4.8.13.1

Pass / fail

Pass

Board flex

Visual

AEC-Q200, method 005

Pass / fail

Pass

W

T

D

D

L

T

R

L

k T

W

•

()

-------------------------

=

T

C

1

T

R

------

=