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Vishay Electro-Films

Revision: 18-Feb-2021

1

Document Number: 61105

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Thin Film Metallized Plates - Custom Substrates

FEATURES

• Metalization on 1, 2, or 6 surfaces

• Various substrate materials

• Tantalum nitride or nickel chromium resistor material

• Sputtered / plated metal systems

• Sizes from 0.020" x 0.020" to 4.500" x 4.500"

• High volume

• Quick delivery available

APPLICATIONS

Vishay EFI metalized plates can be used as stand-offs,

jumpers or bonding pads in hybrid packages when diced to

small sizes; they are also available with no metallization

(bare ceramic) for use as spacers or insulators. Larger sized

plates can be used where the customer wants to pattern

and etch substrates in-house.

Note

• For any plates smaller than 1.000" x 1.000" or where plate size is not available, metal is only available on one or two surfaces (front or back)

SUBSTRATE MATERIALS

MATERIAL CODE

MATERIAL

SURFACE FINISH

(μ" CLA)

APPLICATION

A

Alumina (99.6)

A

< 3 front / < 4 back as-fired

Cost effective material with wide

range of applications

L

< 12 lapped

P< 1 polished

BBeryllium oxide

L

15 to 40 lapped

Highest thermal conductivity

(285 W/mC)

P< 3 polished

N

Aluminum nitride

L

10 to 20 lapped

High thermal conductivity

(170 W/mC)

P< 2 polished

PLATE SIZE

X (mils)

Y (mils)

20

20

50

50

100

100

200

200

500

500

1000

1000

2000

2000

4500

4500

x

y